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Sr Plasma Etch Process Engineer (8970)

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

 

 

Qorvo has an opening for a Sr Plasma Etch Process Engineer at our Hillsboro, Oregon facility.

 

The Sr Plasma Etch Process Engineer will be part of a collaborative team working to improve Qorvo’s Hillsboro, OR GaAs wafer fab. 

 

 

RESPONSIBILITIES:

 

  • Maintain and continuously improve a safe workplace environment
  • “Hands-on” process module ownership in a dynamic 24/7 manufacturing operation
  • Technical data analysis that discovers root causes for problems, paths toward improvement, equipment / output matching and the impact of processing on device performance and yield.
  • Independent work to achieve goals and improve factory metrics with technical leadership opportunities
  • Work within cross-functional groups that helps the team define problems and goals - and succeed in reaching those goals
  • Technical problem solving independently, or (more often) in teams
  • Determining accurate completion dates for goals and projects, then staying on-schedule, or escalating when issues occur
  • Creating novel solutions to save costs, time, materials and prevent waste in the manufacturing process
  • Determining risk from proposed engineering changes, appropriate risk exposure and monitoring procedures
  • Understanding process impacts on safety, quality, cost, and manufacturing output

 

QUALIFICATIONS:

 

  • Bachelor's degree in Engineering or Physical Science 
  • 5+ years of experience working with plasma microelectronics fabrication processes in a manufacturing environment.
  • For this process engineering position, previous experience in wafer fabrication / microelectronics plasma processing in a manufacturing environment is required, 
  • Understanding of statistical process control (SPC), design of experiments (DOE), fault detection and classification (FDC), and basic RF and vacuum science concepts.
  • Exposure with data analysis tools (Spotfire, JMP).
  • Programming experience preferred: script writing, SQL queries, Spotfire.
  • Experience in development and completion of qualification plans.
  • Demonstrated application of structured problem-solving methods.
  • Successful candidates must be independent contributors comfortable collaborating in teams to gather and review data that drives solutions to technical problems,
  • Must be flexible and able to adjust to changing goals, objectives, and policies of the company, and have excellent time management and organization skills.
  • Versatility and ability to work on multiple tasks.
  • Must be proficient in MS Word, Excel, PowerPoint, and Windows-based software.
  • Experience with concept and practices of Continuous Improvement and Lean Manufacturing.
  • Strong oral and written communication skills

 

Preferred qualifications:

MS degree or PhD (less years of experience may be required with higher level degree)

Plasma Etch Processing experience strongly preferred

 

 

This position is not eligible for visa sponsorship by the Company.

 

 

MAKE A DIFFERENCE AT QORVO   

 

 We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

 

We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.