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Packaging Engineering Intern (8185)

Qorvo
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Qorvo is All Around You! We manufacture innovative RF solutions at the center of connectivity to enable high-performance applications for advanced wireless devices, wired and wireless networks and defense radar and communications for 5G networks, cloud computing, the Internet of Things, and other emerging applications. We are a global company thriving on a culture of innovation, diversity, and inclusion. Our people are always at the core of Qorvo’s innovation. Qorvo is a place to stretch your imagination and push boundaries to achieve success. Learn more about Top 10 Reasons to make a career at Qorvo.

 

Qorvo’s Internship Program is designed for college students currently enrolled in an accredited Bachelor’s, Master’s, or PhD program. Qorvo offers real work experience, exposure to upper management, and the opportunity to pursue full time opportunities, as available.

 

Qorvo’s Internship Program offers:

  • Mentorship Program
  • Lunch and Learn Series
  • Team based work environment
  • Formal evaluation process with real time feedback
  • Networking and social opportunities
  • Meaningful assignments with a final presentation

Responsibilities may include:

  • Learn about TD Technology Development projects methodologies - to help and improve the process
  • Learn about Design Rules and Assembly Process - Forster and mentoring 
  • Review Assembly and Marking diagram - look for opportunities to improve
  • Material and BOM review and support of project deployment
  • Onsite hands on learning semiconductor assembly processes -
  • Other minor activities related to documentation and continuous improvement (A3s - Lean)

 

Qualifications:

  • BS in Materials Science or Mechanical Engineering
  • Mechanical/Material Engineering skills
  • Background with packaging materials (theoretical or practical). i.e. solder, epoxy, flux, mold compound preferred
  • Background with assembly process (theoretical or practical). i.e. Wire Bond, Die Attach, Flip Chip preferred
  • Communication and presentation skills
  • Ability to manage and drive problem resolution
  • Demonstrate strong analytical thinking skills
  • 3.0 GPA or higher

 

This position is not eligible for Visa sponsorship by the company.