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Packaging Intern (8201)

Qorvo is All Around You! We manufacture innovative RF solutions at the center of connectivity to enable high-performance applications for advanced wireless devices, wired and wireless networks and defense radar and communications for 5G networks, cloud computing, the Internet of Things, and other emerging applications. We are a global company thriving on a culture of innovation, diversity, and inclusion. Our people are always at the core of Qorvo’s innovation. Qorvo is a place to stretch your imagination and push boundaries to achieve success. Learn more about Top 10 Reasons to make a career at Qorvo.

 

Qorvo’s Internship Program is designed for college students currently enrolled in an accredited Bachelor’s, Master’s, or PhD program. Qorvo offers real work experience, exposure to upper management, and the opportunity to pursue full time opportunities, as available.

 

Qorvo’s Internship Program offers:

  • Mentorship Program
  • Lunch and Learn Series
  • Team based work environment
  • Formal evaluation process with real time feedback
  • Networking and social opportunities
  • Meaningful assignments with a final presentation

Responsibilities may include:

  • Learn about Design Rules and Assembly Process
  • Utilize mechanical and thermal simulation techniques
  • Develop thermal/mechanical simulation best practices to enable efficient automation
  • Onsite hands-on learning of semiconductor assembly processes
  • Other minor activities related to documentation and continuous improvement (A3s and Lean)

 

Qualifications:

  • BS in Materials Science, Physics or Mechanical Engineering
  • Mechanical/Material Engineering skills
  • Communication and presentation skills
  • Ability to manage and drive problem resolution
  • Demonstrate strong analytical thinking skills
  • 3.0 GPA or higher

 

This position is not eligible for Visa sponsorship by the company.