[Summer 2025] Failure Analysis Department Intern

As a Failure Analysis Department Intern you will be critically supporting the TSMC Arizona fab to ensure quality in our world-leading manufacturing processes.  All interns will be a part of a 10-week technical development program within our state-of-the-art semiconductor facilities. This program is designed to identify future engineering leaders of TSMC Arizona. The development program will offer valuable industry and functional insight. You will have the opportunity to have a mentor and learn from senior engineers and executives at the company. Example projects include improvement of sample preparation and analysis techniques, collaborating with multimillion-dollar lab tool vendors to enhance tool performance and functionality, and optimizing the methodology of information communication from fab module customers to the labs.

What you will learn & how you will contribute:

During this internship, you will gain exposure to semiconductor production processes, understand the challenges involved in maintaining stability in those processes, as well as the crucial role that the lab plays in ensuring the overall success of the Arizona operation. Your exposure to customers in the fab, equipment vendors and technicians/engineers will provide you with valuable experience on balancing competing needs and priorities, tolerating ambiguity, conflict resolution and process optimization. Your perspective and fresh ideas will help to further improve the lab operations and therefore the value we provide to our customers.

Minimum Qualifications:

Applicants must be legally eligible to work in the United States and have:

• Must be currently enrolled at an accredited university, in one of the following degree programs: Masters/PhD in Materials Science and Engineering, Electrical Engineering, Physics, Chemistry or related.
• Must be able to work full-time (40 hours per week) on-site at our Phoenix location from May 19th, 2025 – August 1st, 2025 for semester system schools or June 16th, 2025 – August 29th, 2025 for quarter system.
• Some exposure to electron microscopy tools (SEM/FIB/TEM) and/or surface analysis tools (Auger/XPS/SIMS/AFM) and/or other material characterization tools is preferred.
• Strong communication, computer, presentation, listening, working with others needed to contribute to the team and TSMC Arizona’s culture.
• List physical requirements here; Ability to occasionally lift 20-30 lbs, moderate amounts of walking to/from/around labs.
• The ability to speak & read Mandarin is preferred, but not required.