2024 US Campus Recruitment - Operations
Operations
Process Integration Engineers play a critical role in semiconductor manufacturing as they coordinate with customers, understand their needs, and collaborate with various engineering units within the fabs to ensure product quality.
Process Engineers focus on maximizing wafer yield by minimizing process variations and excursions in the manufacturing process. They work with a team of device, integration, yield, lithography, etch, and thin films experts or external suppliers to drive leading-edge integrated module development, control and improvements.
Equipment Engineer are critical in increasing product yield by enhancing machine efficiency and optimizing machine components. They leverage tools such as AI, Machine learning, the FDC real-time data acquisition system, and external sensors to analyze machine conditions in real time to solve and prevent problems.
Intelligent Manufacturing Engineer utilize big data analysis and machine learning to optimize production scheduling and lead the technical team to ensure smooth operation of the manufacturing process to achieve daily production capacity goals.
Facility Engineers are responsible for planning, constructing, operating, and maintaining semiconductor plant facility systems. This includes conduction risk analysis of facility system operations, ensuring optimal supply quality, resource, and energy allocation, and managing construction safety.
Advanced Packaging Technology and Service Engineer works on TSMC’s efficient and high density packaging technology to improve chip performance, reduce power consumption and package size, as well as increase system integration for high performance electronic products.
Qualification:
- Bachelor’s degree in Engineering, Material Science, Physics, Chemistry or Optics
- Strong communication and problem solving skills
- Ability to drive operational efficiencies
- Mandarin Chinese preferred but not required
- Willing to relocate to Taiwan (relocation assistance provided)