Packaging Material Development Intern
- We are looking for an intern with experience and interest in Semiconductor/Optoelectronics Packaging field.
- Hands-on experiences on using polymeric materials and knowledge in the dispensing processes.
- Working knowledge in polymer thermal and UV cure chemistry and CTE/cure shrinkage control through formulation/chemistry/molecular design.
- In-depth knowledge in adhesive bonding fundamentals and surface treatment for adhesion improvement on different surfaces (polymer, ceramics, Cu etc.)
- Working knowledge in polymer characterization and failure tools such as FTIR, DSC, TMA, DMA, TGA, SEM/EDX, XPS, TOF-SIMS etc.
- Design of experiments and analysis metrics to benchmark assembly processes.
- Statistical analysis of data to provide concise assessment summary and technical recommendations.
- General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA and other characterization techniques.
- Good engineering problem solving skills with strong engineering physics and fundamentals, and ability to work independently.
- Good communication skills.