Summer 2027 STEM Research Internship: DoW HBCU/TCU SRIP
Take your STEM education beyond the classroom and into real-world research.
The Department of War (DoW) HBCU/TCU Summer Research Internship Program (SRIP) offers students and recent graduates the opportunity to gain hands-on research experience at DoW facilities nationwide. Work alongside scientists, engineers, and research professionals on innovative projects that address real-world challenges while developing technical skills, building professional connections, and exploring future career opportunities.
Through immersive research, mentorship, and professional development, interns gain valuable experience that bridges academic learning with practical application. Participants also have the opportunity to present their research findings at the DoW Institutes of Higher Education Opportunities Workshop and Intern Symposium, sharing their work with professionals across the DoW research community.
2027 Program Details
- Internship: June 2, 2027, to August 17, 2027
- Stipends: $1,500 per week
- Relocation payment: $1,000.00
- Housing: Provided by the program
- Intern Symposium & Workshop: July 22 and 23, 2027
- Deliverables: Poster, Abstract, and Program Evaluation
- Opportunities and Skills needed: https://dowhbcutcuinternship.com/facilities/
Eligibility Requirements
- U.S. Citizenship (no dual citizenship)
- Current enrollment in a Historically Black College and University (HBCU) or Tribal College or University (TCU)
- Major in a STEM or DoW-relevant academic discipline
- 18 years or older at the time of application
- Full-time student or recent graduate (December 2026 or later)
- GPA of 3.0 or higher on a 4.0 scale
- Possession of a Federal ID, such as a REAL ID* or a valid U.S. Passport
- Receipt of a favorable interim background investigation
How to Apply
Application Window: October 26, 2026-January 13, 2027.
Apply Here: https://dowhbcutcuinternship.com/application-details-instructions/