散热工程师Thermal Engineer

散热工程师

Thermal Engineer

加入龙旗科技硬件研发团队，负责智能手机、平板、智能穿戴等智能终端产品的系统散热方案设计与验证，用专业的热管理技术为全球领先品牌打造高性能、低功耗的智能设备

Joined the hardware R&D team at Longcheer Technology, responsible for the design and verification of system thermal solutions for smart terminal products such as smartphones, tablets, and smart wearables. Utilizing professional thermal management technology, we create high-performance, low-power smart devices for leading global brands.

responsibilities

1.负责产品前期堆叠阶段的热风险评估与热设计方案优化

2.负责产品散热方案的制定、验证与导入工作

3.负责热管理新技术与新材料的调研及导入

4.参与散热标准和规范的制定

5.负责散热方案的案例总结与技术交流

1. Responsible for thermal risk assessment and thermal design scheme optimization during the early product stacking stage.

2. Responsible for the formulation, verification, and implementation of product heat dissipation solutions.

3. Responsible for the research and implementation of new thermal management technologies and materials.

4. Participate in the formulation of heat dissipation standards and specifications.

5. Responsible for summarizing heat dissipation solution case studies and facilitating technical exchanges.

requirements

本科及以上学历，热能与动力工程、工程热物理、电子信息、通信、自动化、机械等相关专业

具备良好的热力学、流体力学、传热学等基础知识

思维敏捷，思路清晰，具备一定的逻辑归纳/分析/推理能力

诚实守信，具备团队合作精神，有责任心

具有较强的实际动手能力，有相关竞赛经历或证书者优先考虑

Bachelor's degree or above in Thermal Energy and Power Engineering, Engineering Thermophysics, Electronic Information, Communication, Automation, Mechanical Engineering, or related fields.

Possesses a solid foundation in thermodynamics, fluid mechanics, and heat transfer.

Quick-thinking, clear reasoning, and strong logical induction/analysis/reasoning abilities.

Honest, trustworthy, a team player, and responsible.

Strong practical skills; relevant competition experience or certifications are preferred.

Bonus Points:

1.有热设计、散热相关的项目经历、竞赛经历或实习经验

2.了解热仿真软件（如Flotherm、Icepak、Fluent等）的基本操作

3.熟悉常见散热材料（导热凝胶、石墨片、VC均热板等）的特性及应用

4.了解智能硬件产品的研发流程和结构设计基础

1. Experience in thermal design and heat dissipation related projects, competitions, or internships.

2. Familiarity with the basic operation of thermal simulation software (such as Flotherm, Icepak, Fluent, etc.).

3. Familiarity with the properties and applications of common heat dissipation materials (thermal conductive gel, graphite sheets, VC heat sinks, etc.).

4. Understanding of the R&D process and structural design fundamentals of smart hardware products.