Senior Packaging Engineer
Sr Packaging Engineer
To work with Product Lines (both Discrete and PIC and IPM) on the package developments including thermal and stress simulation for internal and external requests.
Primary Job Responsibilities/Duties:
- Interact with Product Lines, Product Engineers and Silicon Designers in US and overseas on package design.
- Interact with internal assembly site and external OSAT (Out Sourcing Assembly and Testing) partners on the package designs and carry out from concepts to MP
- Interact with material suppliers, such as LF, clip, solder, mold compound and assembly tools for assembly process enhancements.
Qualifications:
- Experiences in Power Electronics package design (Si, GaN, SiC; LF based, substrate based)
- MS degree and above
- Experience in AutoCAD and SoldWorks for package designs
- Experiences Ansys for thermal and stress simulation
- Lead Frame (LF), design, clip design, wire bond
- Experiences in RD concept development and novel power electronics packaging technologies
- Experience with assembly manufacturing processes and environment (soldering, die attach, wire bonding and molding
- Experiences in MIS substrate design and IPM design is a plus
- Professional communication in technical subjects with internal and external groups.