PREP0004384 Advanced Packaging Researcher

Advanced Packaging Reliability Researcher

Project Description:

The Infrastructure Materials Group at the National Institute of Standards and Technology seeks a researcher with extensive expertise in finite element analysis and knowledge of one or more of the following technical areas: instrumented mechanical testing, adhesion testing, polymer degradation characterization, and material damage analysis and modeling.

If selected, you will play a significant role in the projects related to modeling and reliability testing of advanced chip packaging and other electronics applications. This includes working with NIST staff and external partners on setting up models to predict the behavior and investigate possible points of failure during the service lifetime of heterogeneous multilayered polymeric, metal, and semiconductor structures, identify crucial material parameters, and plan and execute experimental research to evaluate changes of these material parameters after aging. The results will be used to understand the root causes of the multilayer failures, providing a scientific basis for test method development, material selection, and product quality assurance for the semiconductor industry.

Key Responsibilities: 

• Develop finite element models of thermomechanical behavior of heterogeneous multilayered systems
• Characterize the degradation of materials and interfaces before, during, and after exposure to accelerated laboratory aging
• Develop reliability models for complex advanced packaging systems
• Provide technical leadership on finite element modeling of failure mechanisms in multilayered polymeric structures
• Disseminate research results through presentations at conferences, publication of journal papers, and technical reports

Desired Qualifications: 

• U.S. citizenship is preferred
• Currently live in the United States
• Ph.D. in Physics, Mechanical Engineering, Electrical Engineering, Materials Science, or Chemical Engineering
• Experience in nano- and micro-scale mechanical testing and materials characterization 
• Experience in finite element modeling of heterogeneous systems
• Experience in advanced semiconductor packaging is preferred 
• Strong oral and written communication skills

Other Details:

• Full-time: the participant is expected to work 40 hours a week
• Location: the participant will work at the NIST Gaithersburg Campus.
• Duration: this is expected to be a one-year position. Extensions are sometimes granted depending on the availability of funds.