Analog IC Design Engineering Intern (RF Design)

Kilby Labs RF Design Intern – Heterogeneously Integrated Advanced Package Modeling The RF Design Intern role is within Kilby Labs, the central R&D organization of Texas Instruments (TI). The lab is chartered to develop novel and innovative technologies and strategies for new business opportunities, drive next generation, differentiated technologies for existing businesses and recruit top technical talent for TI. Responsibilities may include: • Design of high frequency advanced package interconnects using FEM simulators • Analyzing the measurement results of high frequency package interconnects (i.e. CuPillars, solder bumps), study of de-embedding and correlation with simulation results • Development of a thermal model for high power advanced packages using FEM solvers • Development of a mechanical model for advanced package structures using FEM solvers . Minimum Requirements • Currently pursuing Masters or PhD degree in Electrical Engineering or related field with RF Power Amplifier design background and RF/mmWave IC design experience • Cumulative 3.0/4.0 GPA or higher Preferred Qualifications • Experience with high frequency electromagnetic solvers • Experience with thermal and mechanical models using FEM solvers • Understanding the high frequency passive component design • Knowledge of RF measurements and de-embedding