Optelligent's mission is to provide design and assembly engineering services with quick turn around times. Optelligent specializes in low volume assembles and is able to accommodate companies that either require or desire that the work be performed in the USA. Optelligent's capabilities include precision optical die to die placements to within 1um, precision wire bond length to control port impedances, and active optical component alignments for optimum coupling. Photonic packaging experience includes butterfly packages, TO cans, chip-on-pcb assemblies, and silicon photonics.
